Effect of the Composition of Polypyrrole Substrate on the Electrodeposition of Copper and Nickel

Electrodeposition of copper and nickel on a variety of substrates including conductive polymer films with two different compositions has been studied

Maria Hepel; Yi‐Ming Chen; Richard Stephenson

2006

Scholarcy highlights

  • Electrodeposition of copper and nickel on a variety of substrates including conductive polymer films with two different compositions has been studied
  • The enhancement of the copper and nickel electrodeposition rate was observed for composite polypyrrole films with cation‐exchange properties in comparison to undoped polypyrrole films with anion‐exchange properties
  • Use of the electrochemical quartz crystal microbalance technique allowed for simultaneous monitoring of voltamperometric and resonance frequency vs. potential or time characteristics
  • The thickness of electropolymerized polypyrrole films as well as the amounts of electrodeposited metals were controlled by monitoring the EQCM resonant frequency
  • The nucleation density has been determined from scanning electron microscope experiments

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