Humidity-Induced Voltage Shift on MEMS Pressure Sensors

Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING

J. Albert Chiou

2003

Scholarcy highlights

  • Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING
  • A hypothesis has been established that poor anodic bonding causes an angstrom-level gap between the silicon substrate and glass
  • Once moisture enters the gap in a vapor form and condenses as water droplets, surface tension can induce a piezoresistive stress effect that causes an unacceptable voltage shift
  • Finite element analyses were performed to simulate the phenomenon and the results correlated well with experimental observations

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