Robust All-Carbon Molecular Junctions on Flexible or Semi-Transparent Substrates Using “Process-Friendly” Fabrication

Most electronic Supporting Information files are available without a subscription to ACS Web Editions

Amin Morteza Najarian

2016

Scholarcy highlights

  • Most electronic Supporting Information files are available without a subscription to ACS Web Editions
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  • Au/electron-beam deposited carbon/anthraquinone/eC/Au junctions were fabricated on Si/SiOx with high yield and reproducibility and were unchanged by 107 current–voltage cycles and temperatures between 80 and 450 K
  • Au/eC/AQ/eC/Au devices fabricated on plastic films were unchanged by 107 current density vs bias voltage cycles and repeated bending of the entire assembled junction
  • EC on Au provides a platform for fabrication and operation of chemically stable, optically and electrically functional molecules on rigid or flexible materials
  • The relative ease of processing and the robustness of molecular junctions incorporating eC layers should help address the challenge of economic fabrication of practical, flexible molecular junctions for a potentially wide range of applications
  • Electrochemistry does the impossible: Robust and reliable large area molecular junctions

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